纯正弦波逆变器1000W 12V转220V户外移动电源PCBA裸板模块主板

Number of Layer

1 - 20 Layer

Maximum Processing Area

680 × 1000MM

Min Board Thickness

2 Layer - 0.3MM ( 12 mil )

4 Layer - 0.4MM ( 16 mil )

6 Layer - 0.8MM ( 32 mil )

8 Layer - 1.0MM ( 40 mil)

10 Layer - 1.1MM ( 44 mil )

12 Layer - 1.3MM ( 52 mil )

14 Layer - 1.5MM ( 59 mil )

16 Layer - 1.6MM ( 63 mil )

18 Layer - 1.8MM ( 71 mil )

Finished Board Thickness Tolerance

Thickness ≤ 1.0MM, Tolerance: ± 0.1MM

1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%

Twisting and Bending

≤ 0.75%, Min: 0.5%

Range of TG

130 - 215 ℃

Impedance Tolerance

± 10%, Min: ± 5%

Hi-Pot Test

Max: 4000V/10MA/60S

Surface Treatment

HASL, With Lead, HASL Free Lead

Flash Gold, Immersion Gold

Immersion Silver, Immersion Tin

Gold Finger, OSP

Order Quantity

1pc – 10,000,000+pcs

Build Time

1 – 5 days, 1 – 2 weeks, or scheduled deliveries

PCB Spec Requirements

PCB whose width/length is less than 30mm should be panelized
Max board size: 500×450 mm
Board Type: Rigid PCBs, Flexible PCBs, Metal core PCBs
Surface finish: lead/lead-free HASL, ENIG, Silver, OSP

Assembly Types

Surface mount
Thro-hole
Mixed technology (SMT & Thru-hole)
Single or double sided placement
Conformal coating
Shield cover assembly for EMI emission control

Solder Type

Lead-free – RoHS

Parts Procurement

Full Turnkey
Partial Turnkey
Kitted/Consigned

Component types

SMT 01005 or larger
BGA 0.4mm pitch, POP (Package on Package)
WLCSP 0.35mm pitch
Hard metric connectors
Cable & wire

SMT Parts Presentation

Bulk
Cut tape
Partial reel
Reel
Tube
Tray

Stencils

Laser-cut stainless steel

Other Techniques

Free DFM Review
Box Build Assembly
100% AOI test and X-ray test for BGA
IC programming
Components cost-down
Function test as custom
Protection technology